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| Wafer Probe |
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Tester : |
Yokogawa TS6700
Chroma3360
Credence D-10
VTT V-777 |
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Prober : |
TSK UF200A
EG 4080X |
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Parallel measurement: |
2 DUT/head |
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| Backgrinding |
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B/G Taping: |
ATM1100C |
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Back grinder: |
DFG 850 |
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B/G Detaping: |
ATRM 2100 |
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B/G Scope: |
8 inch or below |
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| Accuracy: |
3um or below |
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| Die Saw |
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Machine: |
DFD 651
DAD321
DAD320
DFD6340 |
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Wafer Size: |
304 mm (12 inches) or below |
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Wafer Thickness: |
800um or below |
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Die Size: |
Min 0.2mm X 0.2mm |
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Scribing line: |
Min 40um |
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| Die Sort |
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Model: |
King Bond KS-120 |
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Accurancy : |
±0.1mm
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speed: |
1.0 sec/chip |
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Die Size: |
0.7mm-2mm |
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