華新半導體有限公司 技術里程
     
 

2000-2004
2005 2006 2007-Today
産品
Watch, OSC,
Thermometer, STN and Color STN LCD
Image Sensor
(2M pixels)
OLED
Image Sensor
(5M pixels)
 
封装
COG / COF
TCP
FPC Circuit Design
 
制程
Die Saw, Die Sort, SMT, COG, Back Grinding,
LCD wafer probe
TCP, Wire Bond,
Logic Wafer Probe
Gold Bumping
Microprocessor Wafer Probe
 
設備
Disco 321/651/850
Yokogawa TS6700
TSK UF200A
VTT-777
Advantest
Teradyne