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E-Creative Technology Limited Technology Roadmap
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2000-2004
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2005 |
2006 |
2007-Today |
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Product |
Watch, OSC,
Thermometer, STN and Color STN LCD
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Image Sensor
(2M pixels)
OLED
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Image Sensor
(5M pixels)
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Package |
COG / COF
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TCP
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FPC Circuit Design
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Process |
Die Saw, Die Sort, SMT, COG, Back
Grinding,
LCD wafer probe
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TCP, Wire Bond,
Logic Wafer Probe |
Gold Bumping
Microprocessor Wafer Probe
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Equipment |
Disco 321/651/850
Yokogawa TS6700
TSK UF200A
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VTT-777
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Advantest
Teradyne
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