BGBM includes a wide range of applications for IC and di iscrete device (Diode,MOSFET,Transistor ,IGBT Etc), s such as , 6 ", 8 ", 12”wafer thinning and multilayer metal evaporation on wafer backside for electric connection and thermal dissipation.

6/8 inch ：≥100um, 12 inch ： ≥150um