Through the introduction of Japan’s advanced DISCO machines, ECT can offer single-cut or double-cut die saw services for 4”, 5”, 6”, 8”, and 12” wafers, including silicon wafer, glass, sensor, and LCD driver ICs.

Wafer Size: 12” or below
Wafer Thickness: 800mm or below
Grain Size: Minimum up to 0.2mm*0.2mm

Main machine equipment models:

12 inch: Disco DFD-6361/DFD-6362

8-inch: Disco DFD-651/DFD-6340